Last week, PhD candidate Fatin Battal attended the 76th IEEE Electronic Components and Technology Conference (ECTC) in Orlando, USA, one of the premier events in semiconductor technologies and electronics packaging, with a record attendance of 2700+ attendees this year.
Fatin was awarded the ECTC Student Travel Grant by IEEE Electronics Packaging Society (EPS), in recognition of his work titled “Organics-free Porous Nano-dendritic Cu Films for High-Power Packaging Interconnects”.
The work was developed within the framework of the Circular Circuits Project, in collaboration with researchers from Radboud University, TU Delft, CITC, and Nexperia.
